



NVIDIA Jetson AGX Orin 32GB Developer Kit 945-13730-0000-000
SPECIFICATIONS:
- GPU: NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 Tensor cores
- CPU: 12-core Arm Cortex-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3
- DL Accelerator 2x NVDLA v2.0
- Vision Accelerator PVA v2.0
- Memory: 32GB 256-bit LPDDR5 204.8 GB/s
- Storage: 64GB eMMC 5.1
- Video Encode: 2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265)
- Video Decode: 1x 8K30 | 3x 4K60 | 6x 4K30 | 12x 1080p60 | 24x 1080p30 (H.265)
Reference Carrier Board:
- Camera: 16 lane MIPI CSI-2 connector
- PCIe: x16 PCIe slot supporting x8 PCIe Gen4
- RJ45: Up to 10 GbE
- M.2 Key M x4 PCIe Gen 4
- M.2 Key E x1 PCIe Gen 4, USB 2.0, UART, I2S
- USB Type-C 2x USB 3.2 Gen2 with USB-PD support
- USB Type-A 2x USB 3.2 Gen2, 2x USB 3.2 Gen1
- USB Micro-B USB 2.0
- DisplayPort DisplayPort 1.4a (+MST)
- microSD slot UHS-1 cards up to SDR104 mode
Dimensions:
- 110mm x 110mm x 71.65mm (Height includes feet, carrier board, module, and thermal solution)
Original: $3,096.00
-65%$3,096.00
$1,083.60Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
SPECIFICATIONS:
- GPU: NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 Tensor cores
- CPU: 12-core Arm Cortex-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3
- DL Accelerator 2x NVDLA v2.0
- Vision Accelerator PVA v2.0
- Memory: 32GB 256-bit LPDDR5 204.8 GB/s
- Storage: 64GB eMMC 5.1
- Video Encode: 2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265)
- Video Decode: 1x 8K30 | 3x 4K60 | 6x 4K30 | 12x 1080p60 | 24x 1080p30 (H.265)
Reference Carrier Board:
- Camera: 16 lane MIPI CSI-2 connector
- PCIe: x16 PCIe slot supporting x8 PCIe Gen4
- RJ45: Up to 10 GbE
- M.2 Key M x4 PCIe Gen 4
- M.2 Key E x1 PCIe Gen 4, USB 2.0, UART, I2S
- USB Type-C 2x USB 3.2 Gen2 with USB-PD support
- USB Type-A 2x USB 3.2 Gen2, 2x USB 3.2 Gen1
- USB Micro-B USB 2.0
- DisplayPort DisplayPort 1.4a (+MST)
- microSD slot UHS-1 cards up to SDR104 mode
Dimensions:
- 110mm x 110mm x 71.65mm (Height includes feet, carrier board, module, and thermal solution)























